Product Description
- Product model: uGmni-200E
- Manufacturing number: MA21-0111-0
- Version: Rev.02 (revised on June 17, 2022)
System purpose and structure
1. Purpose
- ISM induction magnetron dry etching system for semiconductor production and experiments.
2. Supported wafer size
- 8 inches (Notch JEITA), compatible with 4/6 inches (optional).
3. System module
- L0: Transfer chamber (aluminum alloy, vacuum transfer system, maximum load 2000g).
- L1: Cassette chamber (stainless steel, 25 slots/13 slots compatible with SMIF pod).
- L2: Aligner (wafer drop type, detection of orientation plane/notch).
- L3: Etching chamber (ISM plasma source, TMP+DRP exhaust, temperature control range -20ºC~+40ºC).
- SMIF loader: Automatically transfer the wafer cassette in the SMIF pod.
Performance indicators
1. Vacuum performance
- Ultimate pressure: L3 chamber ≤1.0×10³ Pa, L0/L1 chamber ≤10 Pa.
- Pumping time: ≤10 minutes for each chamber from atmospheric pressure to target pressure.
2. Etching performance
- SiO etching uniformity: ±5% within the wafer, ±5% between wafers (3 consecutive wafers).
- Photoresist etching rate: >100 nm/min, uniformity ≤±5%.
3. Safety indicators
- Helium leakage rate ≤5.0×10 Pa·m³/sec.
Components and customer supply scope
1. Core components
- L3 chamber: RF power supply (1kW/13.56MHz), electrostatic chuck (ESC), turbomolecular pump (TMP).
- Gas system: 4-way MFC (supports Ar/O/N/CF4), He temperature control.
2. Customers need to provide
- 8-inch SiO/Si wafers (25 pieces), SMIF pods (2 pieces), 25-slot/13-slot cassettes (2 pieces each).
Utilities and installation
1. Space and weight
- Main body size: W1917×D2002×H2251 mm, about 1300 kg.
2. Environmental requirements
- Voltage: 3φ 200V±10%, frequency 60Hz, power consumption 26kVA.
- Temperature: 20~35ºC, humidity ≤50% (no condensation).
3. Safety grounding
- Type-A grounding (resistance ≤10Ω), Type-D grounding (resistance ≤100Ω).
System Overview
This system has the following structure.
Detailed Photos
Below are pictures and labels of this product




Company Profile
Shenzhen Huiyan Precision Technology Co., Ltd. was established in 2010 and is located in Dahe Industrial Park, Longhua, Shenzhen, China, with a plant area of 20,000 square meters. We are an enterprise with an international vision, focusing on providing full-chain industrial production solution services for manufacturing chain equipment. From equipment sales to precise matching of visual systems, from industrial data services to equipment recycling, we have professional teams and rich experience. Meanwhile, we have close cooperative relationships with Apple, Foxconn, ABB, and KUKA. Choosing Shenzhen Huiyan Precision means choosing a professional and reliable partner. We look forward to joining hands with you to jointly explore the international market and achieve win-win development!


Our Advantages
1. We have many years of in-depth experience in the industrial field and have a deep understanding of market demands and industry trends.
2. Be able to offer competitive prices.
3. The company adheres to the business philosophy of honesty first and customer first.
4. Be able to complete the delivery in time.
5. Be able to respond to customers' questions and demands in the shortest time.
FAQ
1. What are the core business and main products of the company?
The company's products cover hardware products, plastic products, electronic products, electronic materials, precision molds, precision jigs, precision fasteners, precision titanium products, mechanical equipment and accessories, vision equipment, environmental protection and purification equipment, etc.
2.How do we ensure quality?
We will conduct inspections before shipment.
3.Why do you purchase from us instead of other suppliers?
We have very favorable prices as well as high-quality products and after-sales service.